Method and apparatus for semiconductor processing

ABSTRACT

A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.

RELATED APPLICATION

This application claims the benefit of U.S. Provisional Application Ser.No. 60/496,479, filed on Aug. 29, 2003. The contents of U.S. ProvisionalApplication Ser. No. 60/496,479 are incorporated herein by reference intheir entirety.

FIELD OF THE INVENTION

The field of the invention relates generally to semiconductormanufacturing equipment and pertains particularly to vacuum equipmentfor enabling sequential processing under vacuum, using different processenvironments, such as cluster tools.

BACKGROUND

Semiconductor substrate processing is typically performed by subjectinga substrate to a plurality of sequential processes to create devices,conductors and insulators on the substrate. FIG. 1 illustrates a priorart semiconductor processing system 100 for performing sequentialprocesses. These processes are generally performed in a processingchamber configured to perform a single step of the production process.In order to efficiently complete the entire sequence of processingsteps, a number of processing chambers 108 are typically coupled to acentral transfer chamber 104 that houses one or more robots 112 tofacilitate transfer of the substrate 124 between the processing chambers108. A semiconductor processing platform having this configuration isgenerally known as a cluster tool, examples of which are the family ofCENTURA.RTM. and ENDURA.RTM. processing platforms available from AppliedMaterials, Inc. of Santa Clara, Calif.

Generally, a cluster tool 100 consists of a central transfer chamber 104having one or more robots 112 disposed therein. The transfer chamber 104is typically surrounded by one or more processing chambers 108, at leastone load lock chamber 106. The processing chambers 108 are generallyutilized to process the substrate 124, for example, performing variousprocessing steps such as etching, physical vapor deposition, chemicalvapor deposition, and the like. Processed and unprocessed substrates 124are housed in a substrate storage cassette 130 disposed in a factoryinterface 102 coupled to the load lock chamber 106.

The load lock chamber 106 is isolated from the factory interface 102 andthe transfer chamber 104 by slit valves 116. Substrates 124 enter thetransfer chamber 104 from the substrate storage cassettes 130 one at atime through the load lock 106. The substrate 124 is first positioned inthe load lock 106 after the substrate 124 is removed from the cassette130. The load lock 106 is then sealed and pumped down to match theoperating pressure of the substrate transfer chamber 104. The slit valve116 between the load lock 106 and transfer chamber 104 is then opened,allowing the substrate transfer robots 112 to access the substrates 124disposed in the factory interface 102. In this fashion, substrates 124may be transferred into and out of the transfer chamber 104 withouthaving to repeatedly re-establish transfer chamber vacuum levels aftereach substrate 124 passes through the load lock 106 or processingchambers 108. Although cluster tool 100 includes six processing chambers108, any number may be used.

SUMMARY

A method and apparatus for semiconductor processing is disclosed. In oneembodiment, a method of transporting a wafer within a cluster tool,comprises placing the wafer into a first segment of a vacuum enclosure,the vacuum enclosure being attached to a processing chamber and afactory interface. The wafer is transported to a second segment of thevacuum enclosure using a vertical transport mechanism, wherein thesecond segment is above or below the first segment.

The above and other preferred features of the invention, includingvarious novel details of implementation and combination of elements,will now be more particularly described with reference to theaccompanying drawings and pointed out in the claims. It will beunderstood that the particular methods and mechanisms embodying theinvention are shown by way of illustration only and not as limitationsof the invention. As will be understood by those skilled in the art, theprinciples and features of this invention may be employed in various andnumerous embodiments without departing from the scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included as part of the presentspecification, illustrate the presently preferred embodiment of thepresent invention and together with the general description given aboveand the detailed description of the preferred embodiment given belowserve to explain and teach the principles of the present invention.

FIG. 1 illustrates a prior art semiconductor processing system 100 forperforming sequential processes;

FIG. 2 illustrates an exemplary vertical transport cluster tool,according to one embodiment of the present invention;

FIG. 3 illustrates an exemplary horizontal transport cluster tool,according to one embodiment of the present invention;

FIG. 4 illustrates an exemplary dual vacuum enclosure cluster tool,according to one embodiment of the present invention;

FIG. 5 illustrates an exemplary horizontal cluster tool, according toanother embodiment of the invention;

FIG. 6 illustrates an exemplary dual linear drive, according to oneembodiment of the present invention;

FIG. 7 illustrates an exemplary dual linear drive in an extendedposition, according to one embodiment of the present invention;

FIG. 8 illustrates an exemplary dual linear drive mechanism, accordingto one embodiment of the present invention;

FIG. 9 illustrates an exemplary dual linear drive mechanism, accordingto another embodiment of the present invention; and

FIG. 10 illustrates an exemplary linear drive with a rotation mechanism,according to one embodiment of the present invention;

FIG. 11 illustrates an exemplary linear drive with a rotation mechanism,according to another embodiment of the present invention;

FIG. 12 illustrates an exemplary method of transporting a wafer,according to one embodiment of the present invention; and

FIG. 13 illustrates a computer system representing an integratedmulti-processor, in which elements of the present invention may beimplemented.

DETAILED DESCRIPTION

A method and apparatus for semiconductor processing is disclosed. In oneembodiment, a method of transporting a wafer within a cluster tool,comprises placing the wafer into a first segment of a vacuum enclosure,the vacuum enclosure being attached to a processing chamber and afactory interface. The wafer is transported to a second segment of thevacuum enclosure using a vertical transport mechanism, wherein thesecond segment is above or below the first segment. According to anotherembodiment of the invention, unlike the robotic mechanisms describedabove that are used in the center of a platform, the present apparatusallows for a distributed linear wafer drive architecture. The lineararchitecture provided and described below does away with the need forradial dominated architectures.

In the following description, for purposes of explanation, specificnomenclature is set forth to provide a thorough understanding of thepresent invention. However, it will be apparent to one skilled in theart that these specific details are not required in order to practicethe present invention.

Some portions of the detailed descriptions that follow are presented interms of algorithms and symbolic representations of operations on databits within a computer memory. These algorithmic descriptions andrepresentations are the means used by those skilled in the dataprocessing arts to most effectively convey the substance of their workto others skilled in the art. An algorithm is here, and generally,conceived to be a self-consistent sequence of steps leading to a desiredresult. The steps are those requiring physical manipulations of physicalquantities. Usually, though not necessarily these quantities take theform of electrical or magnetic signals capable of being stored,transferred, combined, compared, and otherwise manipulated. It hasproven convenient at times, principally for reasons of common usage, torefer to these signals as bits, values, elements, symbols, characters,terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar termsare to be associated with the appropriate physical quantities and aremerely convenient labels applied to these quantities. Unlessspecifically stated otherwise as apparent from the following discussion,it is appreciated that throughout the description, discussions utilizingterms such as “processing” or “computing” or “calculating” or“determining” or “displaying” or the like, refer to the action andprocesses of a computer system, or similar electronic computing device,that manipulates and transforms data represented as physical(electronic) quantities within the computer system's registers andmemories into other data similarly represented as physical quantitieswithin the computer system memories or registers or other suchinformation storage, transmission or display devices.

The present invention also relates to apparatus for performing theoperations herein. This apparatus may be specially constructed for therequired purposes, or it may comprise a general purpose computerselectively activated or reconfigured by a computer program stored inthe computer. Such a computer program may be stored in a computerreadable storage medium, such as, but is not limited to, any type ofdisk including floppy disks, optical disks, CD-ROMs, andmagnetic-optical disks, read-only memories (ROMs), random accessmemories (RAMs), EPROMs, EEPROMs, magnetic or optical cards, or any typeof media suitable for storing electronic instructions, and each coupledto a computer system bus.

The algorithms and displays presented herein are not inherently relatedto any particular computer or other apparatus. Various general purposesystems may be used with programs in accordance with the teachingsherein, or it may prove convenient to construct more specializedapparatus to perform the required method steps. The required structurefor a variety of these systems will appear from the description below.In addition, the present invention is not described with reference toany particular programming language. It will be appreciated that avariety of programming languages may be used to implement the teachingsof the invention as described herein.

FIG. 2 illustrates an exemplary vertical transport cluster tool,according to one embodiment of the present invention. Cluster tool 200has a central vertical transport drive 2 within a vertically-orientedvacuum enclosure 3. Vacuum enclosure 3 may be made from polishedstainless steel (or other similar type of metal or alloy) pipe sectionswith pipe flanges 210 according to one embodiment of the presentinvention. The pipe sections 10 may be finished and polished in avariety of ways, but—being enclosures for high vacuum movement ofwafers, the pipe sections 10 follow specifications used in thesemiconductor manufacturing industry. Flanges 210 at each end of eachpipe section have diameter and hole patterns appropriate to theapplication. Flanges 210 are finished and grooved for o-ring seals andother similar high-vacuum seals.

Cluster tool 200 has three sections 10 separated by horizontal transportassemblies 11 and 12. At a lower end a pumping module 4 is sealedthrough a gate valve 9 to the vertical assembly of sections 10, 11 and12. Pumping module 4 provides rough and high vacuum pumping to maintainvacuum within vacuum enclosure 3. Additionally, pumping module 4 canprovide vacuum conditions for processing chamber 6. A vertical supportdrive 2 for a vertical transport mechanism (not shown within sections10, 11 and 12) is positioned at the top end of the vertical assembly ofpipe sections 10 and horizontal transport modules 11 and 12. Thevertical transport mechanism and its drive 2 can be any of several sortsof elevator, such as an elevator actuator assembly manufactured by theSemiconductor Engineering Group, Inc.

Also included in cluster tool 200 is a horizontal transport assembly 12that serves as a load and unload station for wafers in process.Horizontal transport assembly 12 also serves as a load lock-chamber withelevator mechanisms (not shown). Horizontal transport assembly 12 ismounted to a gate valve 5 via an extension 13. Extension 13 serves as anouter chamber of the transfer assembly, which is essentially a flangedsection of stainless steel pipe. A linear wafer drive transportmechanism 1 mounts to a second extension 13 via another valve 5.Transport mechanism reaches through assembly 12 to bring wafers into thevertical transport mechanism and to place processed wafers from thevertical transport to a substrate storage cassette 8. Cassette 8 may bepart of a factory interface, such as factory interface 102.

Horizontal transport assembly 11 is attached to linear wafer drivetransport mechanism 1 via a valve 5 and extension 13. A processingchamber 6 is isolated from the horizontal transport assembly 11 by valve5 and extension 13. The processing chamber 6 may be a processing chambersuch as chamber 108 of cluster tool 100, according to one embodiment.Additionally, processing chamber 6 may have a wafer carousel or othertransporting mechanism such that a number of wafers may processedsimultaneously.

Although only one drive mechanism 1 and chamber 6 (or cassette 8) areillustrated per assembly 11 and 12, additional drive mechanisms 1 may beused. The combination of linear drive 1 and horizontal assembly 11eliminates the need for robots to transfer substrates into processchamber 6. Additionally, cluster tool 200 removes wafer transportmechanisms from within a center transfer chamber such as vacuumenclosure 3. Thus, linear drive 1 is external to vacuum enclosure 3 andoperates to move substrates between processing chamber 6 and vacuumenclosure 3.

FIG. 3 illustrates an exemplary horizontal transport cluster tool 300,according to one embodiment of the present invention. Horizontal clustertool 300 has three distinct processing chambers 306 and threecooperating linear transport drives 301 operating through gate valves305. Processing chambers 306 are coupled to a vacuum chamber 303, wherevacuum chamber 303 can be assembly 11 of vertical transport cluster tool200. It is important to note that although one layer of chambers isillustrated in horizontal cluster tool 300, numerous layers can existthrough vertical stacking along the vacuum chamber of a vertical clustertool, such as vacuum chamber 3 of vertical cluster tool 200. Forexample, the horizontal transport cluster tool 300 can be attached asassembly 11, with an additional layer of components of horizontaltransport cluster tool 300 mounted above or below assembly 11.

Additionally, any one of processing chambers 306 can be replaced with afactory interface such as factory interface 102. Horizontal cluster tool300 includes linear transport drives 301 that transport substrate wafersbetween processing chambers 306 and vacuum enclosure 303. Lineartransport drive 301 includes a blade (not shown) that extends through agate valve 305, through extensions 313, through vacuum enclosure 303,through a second extensions 313, through a second gate valve 305 to aprocessing chamber 306, where linear transport drive 301 places orremoves a substrate wafer. The blade 380 will be described in greaterdetail below.

Horizontal cluster tool 300 also includes an elevator mechanism 390 thattransports a substrate to another level (assembly) of vertical transportcluster tool 200, according to one embodiment of the present invention.For example, a fresh wafer may be removed from cassette 8, verticallytransport from assembly 12 to assembly 11. In one embodiment section 11of FIG. 2 corresponds to vacuum enclosure 303 of FIG. 3 from which thefresh wafer may be distributed to any processing chamber 306.

The combination of linear drives 301 with vacuum enclosure 303eliminates the need for robots to transfer substrates into processchambers 306. Additionally, cluster tool 300 removes wafer transportmechanisms from a center transfer chamber such as vacuum enclosure 303.Thus, linear drives 301 are external to vacuum enclosure 303 and operateto move substrates between processing chambers 306 and vacuum enclosure303. In additional embodiments, any number of processing chamber 306 maybe implemented around vacuum enclosure 303 according to the needs of theprocess.

FIG. 4 illustrates an exemplary dual vacuum enclosure cluster tool 400,according to one embodiment of the present invention. Dual-vacuumenclosure cluster tool 400 has two vertical transport mechanisms (notshown) within each vacuum enclosure 403. Each vertical transportmechanism is driven by a vertical transport drive, such as verticaltransport drive 402 and vertical transport drive 420. Vacuum enclosures403 may be connected in a twin-tower arrangement such that a singlecassette 8 within a company interface 102 may serve two separatevertical transports 403, which may support one or more horizontalcluster tools 300 inserted as horizontal assemblies 411. Note, that dualvacuum enclosure cluster tool 400 does not illustrate any processingchambers attached to horizontal assemblies 411.

Linear drive 401 transports one or more wafers between the two vacuumenclosures 403. For example, a wafer within section 422 is removed bylinear drive 401, and carried to section 412 through extension 413 andgate valve 405, where vertical transport drive 402 elevates the wafer tohorizontal assembly 411 for processing. In alternate embodiments,additional vacuum enclosures 403 may be interconnected to cluster tool400 using additional linear drives 401, gate valves 405 and extensions413.

FIG. 5 illustrates an exemplary horizontal cluster tool 500, accordingto another embodiment of the invention. Horizontal cluster tool 500includes three processing chambers 506, although additional (or fewer)processing chambers can be used. A vacuum enclosure 503 is attached to acompany interface 502. Attached between each processing chamber 506 andthe vacuum enclosure 503 is a dual linear drive 501. Each dual lineardrive 501 connects to processing chamber 506 and vacuum enclosure 503through extensions and gate valves (not shown), according to oneembodiment.

As illustrated in FIG. 5, dual linear drives 501 are disposed betweenvacuum enclosure 503 and processing chambers 506. This disposition is indirect contrast to horizontal cluster tool 300 in which its processingchamber separate the linear drives from the vacuum enclosure.

The combination of dual linear drives 501 with vacuum enclosure 503eliminates the need for robots to transfer substrates into processchambers 506. Additionally, cluster tool 500 removes wafer transportmechanisms inside a center transfer chamber such as vacuum enclosure303. Thus, dual linear drives 501 are external to vacuum enclosure 503and operate to move substrates between processing chambers 506 andvacuum enclosure 503. A more detailed description of the operation ofdual linear drives 501 is provided below.

FIG. 6 illustrates an exemplary dual linear drive 601, according to oneembodiment of the present invention. Dual linear drive 601 operates totransport two wafers 660 between a vacuum chamber and a processingchamber (both not shown). The wafers 660 enter and exit through gatevalves 605. Additionally, the wafers 660 sit upon blades 661. Besidesextending from within enclosure 670 to processing chambers and vacuumchambers, blades 661 and wafers 660 can be rotated within enclosure 670by one hundred and eighty (180) degrees. The rotation of blades 661 andwafers 660 will be described below.

The ability to rotate blades 661 and wafers 660 allows a fresh wafer tobe placed within a processing chamber at the same time a processed wafer(removed from the same processing chamber) is returned to a vacuumenclosure. Dual linear drive 601 doubles the throughput of the a singlewafer transport mechanism. Dual linear drive 601 is illustrated in ahome position where both wafers 660 and both blades 661 are fullycontained within enclosure 670.

FIG. 7 illustrates an exemplary dual linear drive 701 in an extendedposition, according to one embodiment of the present invention. Duallinear drive 701 includes an enclosure 770 having two gate valves 705.Dual linear drive 701 has both blades 761 extended such that wafers 760are outside enclosure 770, having passed through gate valves 705. Wafers760 can then be placed within a processing chamber or vacuum enclosure(or taken from a processing chamber or vacuum enclosure). In alternateembodiments, one blade and wafer may be kept within enclosure 770, whilethe second blade and wafer is extended.

FIG. 8 illustrates an exemplary dual linear drive mechanism 800,according to one embodiment of the present invention. Drive mechanism800 transports two wafers 860 into and out of an enclosure (not shown)using blades 861 that support wafers 860. Blades 861 glide along rails880 via rollers 862. According to one embodiment, three rollers 862 areused per blade, although any number may be used. Rails 880 are shaped tomate with grooves within rollers 862 that resemble pulley wheels,according to one embodiment. In an alternate embodiment, ball bearingsare used to allow blades 861 to glide within rails 880.

Blades 861 are moved using motor 870 in combination with pulleys 871,belt 872 and attachment tabs 863. Pulleys 871 are placed along thecenter rail, such that belt 872 can be stretched between them for theentire length of the rails 880. Motor 870 rotates one pulley 871 causingbelt 872 to move along the center rail. Each blade 861 is attached tothe belt 872 via attachment tabs 863 (one not shown). Thus, as the belt872 moves, blades 861 carry wafers 860 into or out of the enclosure. Thedirection the motor 870 spins pulley 871 is reversed to reverse themotion of blades 861.

The rails are made from stainless steel according to one embodiment. Thepulleys are made from stainless steel, according to one embodiment,although other materials including ceramics, carbon fiber, aluminum, andsimilar materials can be used as well.

According to another embodiment, dual linear drive mechanism 800 ismodified to be a single linear drive mechanism, such as linear drives201, 301, and 401. Only one blade 861 is used with two rails 880, and norotational mechanism is provided. Similarly, in another embodiment, if asingle blade linear drive is desired as a substitute for the dual lineardrives 501, a single blade can be used as described with the ability torotate one hundred and eighty (180) degrees. In this example, a wafercan be removed from a process chamber, rotated within the enclosure ofthe linear drive and then placed in a vacuum enclosure. Then a freshwafer can be placed into the process chamber from the vacuum enclosureusing the same process in reverse.

FIG. 9 illustrates an exemplary dual linear drive mechanism 900,according to another embodiment of the present invention. Drivemechanism 900 transports two wafers 960 into and out of an enclosure(not shown) using blades 961 that support wafers 960. Blades 961 glidealong rails 980 via rolling guide 990. According to one embodiment, onerolling guide 990 is used per blade, although any number may be used.Rails 980 are shaped to mate with grooves within rolling guide 990.

Blades 961 are moved using a small piezoelectric motor (not shown) incombination with rolling guide 990, and ceramic strip 981. The motor isfixed to the side of rolling guide 990 closest to the ceramic strip 981.When energized the motor moves rolling guide 990 along the ceramic strip981 and glide on top of rail 980. The direction of the motor can bereversed to reverse the motion of blades 861.

The rails 980 are made from stainless steel according to one embodiment,but can also be manufactured from aluminum or other similar substances.The rails 980 can be a rail such as those manufactured by IKOInternational, Inc. of Japan. The rolling guide 990 can be a Solidlubrication linear motion rolling guide, such as those manufactured byIKO International, Inc. of Japan. According to one embodiment, the motoris a piezoelectric motor such as the HR Series solid state motorsmanufactured by Nanomotion, Ltd. of Israel.

FIG. 10 illustrates an exemplary linear drive 1000 with a rotationmechanism, according to one embodiment of the present invention. Lineardrive 1000 includes a top enclosure 1010 and a bottom enclosure 1050sealed by an O-ring 1030. Both the top enclosure 1010 and bottomenclosure 1050 can be constructed from aluminum, stainless steel, carbonfiber, or similar material. The O-ring 1030 allows for the sealing oflinear drive 1000 to create vacuum conditions within. Mechanism 1020 isany one of the linear drive mechanisms described above, including rails,blades and other supporting architecture.

The mechanism 1020 is mounted to backing plate 1043, according to oneembodiment. In alternate embodiments, a backing plate 1043 is not used.Backing plate 1043 along with mechanism 1020 rotate in a circularfashion over the bottom enclosure 1050 on bearings 1090. The bearings1090 can sit within a circular track grooved into the bottom enclosure1050, according to one embodiment. Attached to the bottom side of thebacking plate is a spindle 1040 surrounded by one or more permanentmagnets 1041. The elements described thus far, exist within a vacuumsealed environment.

The spindle 1040, backing plate 1043, and mechanism 1020 are caused torotate by one or more ring magnets 1060 outside the bottom enclosure1050. The ring magnets 1060 are connected to a motor 1070 via a belt1080. By causing the motor 1070 to rotate the belt 1080 moves ringmagnet 1060, ultimately turning the mechanism 120 within linear drive1000.

FIG. 11 illustrates an exemplary linear drive 1100 with a rotationmechanism, according to another embodiment of the present invention.Linear drive 1100 includes a top enclosure 1110 and a bottom enclosure1151 sealed by an O-ring 1130. Both the top enclosure 1110 and bottomenclosure 1151 can be constructed from aluminum, stainless steel, carbonfiber, or similar material. The O-ring 1130 allows for the sealing oflinear drive 1100 to create vacuum conditions within. Mechanism 1120 isany one of the linear drive mechanisms described above, including rails,blades and other supporting architecture.

The mechanism 1120 is mounted to backing plate 1143, according to oneembodiment. In alternate embodiments, a backing plate 1143 is not used.Backing plate 1143 along with mechanism 1120 rotate in a circularfashion over the bottom enclosure 1151 on bearings 1190. The bearings1190 can sit within a circular track grooved into the bottom enclosure1151, according to one embodiment. Attached to the bottom side of thebacking plate 1143 is a circular guide ring 1172 constructed fromceramic, according to one embodiment. Attached to the bottom enclosure1151 is a motor 1171. Motor 1171 can be a piezoelectric motor such asthe HR Series solid state motors manufactured by Nanomotion, Ltd. ofIsrael. Both the motor 1171 and guide ring 1172 can be glued into theirrespective positions. The elements described thus far, exist within avacuum sealed environment. The backing plate 1143, and mechanism 1120are caused to rotate when the motor 1171 is energized causing theportion of the motor 1171 to contact and move the guide ring 1172.

FIG. 12 illustrates an exemplary method of transporting a wafer,according to one embodiment of the present invention. A wafer, such aswafer 660 is placed into a first segment of a vacuum enclosure, such asassembly 12 of vacuum enclosure 3. (block 1210) Linear wafer drive 1physically moves the wafer into and out of vacuum enclosure 3. Verticaltransport mechanism and drive 2 transports the wafer to a second segmentof the vacuum enclosure, such as assembly 11. (block 1220) The wafer canthen be removed from vacuum enclosure 3 by another linear wafer drive 1,and into a processing chamber 6. (block 1230)

Cluster tools, such as those described above are controlled by a PC-typecomputer motion control system with software included. The softwarerunning on the computer directs the movement of wafers between chambersand enclosures. FIG. 13 illustrates a computer system 1000 representingan integrated multi-processor, in which elements of the presentinvention may be implemented. The system 1300 may represent a computerused to control the cluster tools described above such as computer 7 ofFIG. 2.

One embodiment of computer system 1300 comprises a system bus 1320 forcommunicating information, and a processor 1310 coupled to bus 1320 forprocessing information. Computer system 1300 further comprises a randomaccess memory (RAM) or other dynamic storage device 1325 (referred toherein as main memory), coupled to bus 1320 for storing information andinstructions to be executed by processor 1310. Main memory 1325 also maybe used for storing temporary variables or other intermediateinformation during execution of instructions by processor 1310. Computersystem 1300 also may include a read only memory (ROM) and/or otherstatic storage device 1326 coupled to bus 1320 for storing staticinformation and instructions used by processor 1310.

A data storage device 1327 such as a magnetic disk or optical disc andits corresponding drive may also be coupled to computer system 1300 forstoring information and instructions. Computer system 1300 can also becoupled to a second I/O bus 1350 via an I/O interface 1330. A pluralityof I/O devices may be coupled to I/O bus 1350, including a displaydevice 1343, an input device (e.g., an alphanumeric input device 1342and/or a cursor control device 1341). For example, web pages andbusiness related information may be presented to the user on the displaydevice 1343.

The communication device 1340 is for accessing other computers (serversor clients) via a network. The communication device 1340 may comprise amodem, a network interface card, or other well known interface device,such as those used for coupling to Ethernet, token ring, or other typesof networks.

The devices described herein may use simple, mostly off-the-shelf linearwafer movement mechanisms, and motion control software. The presentcluster tools have many applications, such as all thin film deposition,anneal, and etch processes in use in memory chip and microprocessormanufacturing.

A method and apparatus for semiconductor processing is disclosed.Although the present invention has been described with respect tospecific examples and subsystems, it will be apparent to those ofordinary skill in the art that the invention is not limited to thesespecific examples or subsystems but extends to other embodiments aswell. The present invention includes all of these other embodiments asspecified in the claims that follow.

1. A method of transporting a wafer within a cluster tool, comprising:placing the wafer into a first segment of a vacuum enclosure, the vacuumenclosure being attached to a processing chamber and a factoryinterface; transporting the wafer to a second segment of the vacuumenclosure using a vertical transport mechanism, wherein the secondsegment is above or below the first segment.
 2. The method of claim 1,further comprising: moving the wafer into and out of the vacuumenclosure using a linear wafer drive, wherein the linear wafer drive isexternal to the vacuum enclosure.
 3. The method of claim 2, furthercomprising: controlling the linear wafer drive and the verticaltransport mechanism with a computer executing processing controlsoftware.
 4. The method of claim 3, wherein moving the wafer includesmoving the wafer through a gate valve.
 5. The method of claim 3, whereinmoving the wafer includes moving the wafer between the vacuum enclosureand the processing chamber.
 6. The method of claim 3, wherein moving thewafer includes moving the wafer between the vacuum enclosure and asecond vacuum enclosure.
 7. A method of transporting a wafer within acluster tool, comprising: moving the wafer between a vacuum enclosureand a processing chamber using a linear wafer drive, wherein the linearwafer drive is external to the vacuum enclosure and the processingchamber.
 8. The method of claim 7, further comprising: controlling thelinear wafer drive with a computer executing processing controlsoftware.
 9. The method of claim 7, wherein moving the wafer includesmoving the wafer through a gate valve.
 10. The method of claim 7,wherein moving the wafer includes moving the wafer between the vacuumenclosure and the processing chamber.
 11. The method of claim 7, whereinmoving the wafer includes moving the wafer between the vacuum enclosureand a second vacuum enclosure.
 12. The method claim 7, wherein thelinear drive is disposed between the vacuum enclosure and the processingchamber.
 13. The method of claim 12, further comprising simultaneouslytransporting a fresh wafer from the vacuum enclosure and a processedwafer from the processing chamber into the linear wafer drive.
 14. Themethod of claim 13, further comprising rotating the fresh wafer and theprocessed wafer within the linear wafer drive.
 15. The method of claim14, further comprising simultaneously transporting the fresh wafer intothe processing chamber and the processed wafer into the vacuumenclosure.
 16. The method of claim 12, further comprising transportingthe wafer from the vacuum enclosure into the linear wafer drive.
 17. Themethod of claim 16, further comprising rotating the wafer within thelinear wafer drive.
 18. The method of claim 17, further comprisingtransporting the wafer from the linear wafer drive into the processingchamber.
 19. A cluster tool, comprising: a vacuum enclosure; a lineardrive attached to the vacuum enclosure; and a processing chamber,wherein the vacuum enclosure includes a vertical transport mechanismthat carries a wafer from a lower segment of the vacuum enclosure to anupper segment of a vacuum enclosure.
 20. A vacuum processing systemcomprising: at least one wafer transport operating vertically through anassembly of end-to-end flanged chamber sections; a load-lock systembetween two of the end-to-end flanged chamber sections acting to bringwafers from outside the system into the vacuum processing system; and aprocessing module between two of the end-to-end flanged chamber sectionsincluding at least one horizontal linear transport mechanisms fortrading wafers horizontally between the vertical wafer transport and aprocessing chamber, through isolation valves.